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No. STSE-CC5097A SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NHSW007T NICHIA CORPORATION -0- Nichia STSE-CC5097A Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 10 30 5 30 -40 ~ +100 -40 ~ +100 Reflow Soldering : 260C Dip Soldering : 260C Hand Soldering : 350C and Duty < 1/10 = (Ta=25C) Unit mA mA V mW C C for 10sec. for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=5[mA] VR= 5[V] IF=5[mA] IF=5[mA] IF=5[mA] Typ. (2.9) (106) 0.31 0.32 (Ta=25C) Max. Unit 3.1 V 50 A mcd - (3) Ranking Item Luminous Intensity Rank S Rank R Rank Q Symbol Iv Iv Iv Condition IF=5[mA] IF=5[mA] IF=5[mA] Min. 125 90 63 (Ta=25C) Max. Unit 180 mcd 125 mcd 90 mcd Luminous Intensity Measurement allowance is 10%. Color Ranks x y x y 0.280 0.248 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b2 0.287 0.330 0.295 0.339 0.296 0.276 0.330 0.318 x y x y 0.287 0.295 0.330 0.318 (IF=5mA,Ta=25C) Rank b1 0.283 0.330 0.330 0.305 0.360 0.339 Rank c0 0.330 0.361 0.360 0.385 0.356 0.351 Color Coordinates Measurement allowance is 0.01. One delivery will include up to two consecutive color ranks and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CC5097A 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure's page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes : : : Heat-Resistant Polymer Epoxy Resin (with Diffused + Phosphor) Ag Plating Copper Alloy 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC5097A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Dip Soldering) Solderability (Dip Soldering) Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=235 5C, 2sec. (using flux, Lead Solder) Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (using flux, Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=10mA Ta=85C, IF=5mA 60C, RH=90%, IF=5mA Ta=-40C, IF=5mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 200m/s2, 100 ~ 2000Hz (Sweep 4min.) 48min., 3directions 75cm Note 1 time Number of Damaged 0/22 1 time over 95% 2 times 0/22 0/22 1 time over 95% 100 cycles 0/22 0/100 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1 time 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22 Vibration Drop 4 times 3 times 0/10 0/10 (2) CRITERIA FOR JUDGING DAMAGE Item Forward Voltage Reverse Current Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol VF IR IV IV Test Conditions IF=5mA VR=5V IF=5mA IF=5mA Criteria for Judgement Min. Max. L.S.L.**) L.S.L.**) 0.7 0.5 U.S.L.*) U.S.L.*) 1.1 2.0 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level -3- These test items are judged by the criteria of Luminous Intensity Condition 2. Nichia STSE-CC5097A-1 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrodes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC5097A-1 (4) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method and the dip soldering method. * Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 260C Max. 240C Max. 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) Dip Soldering Pre-heat Pre-heat time Solder bath temperature Dipping time 100C Max. 60 sec. Max. 260C Max. 10 sec. Max. Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only) Although the recommended soldering conditions are specified in the above table, reflow, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 240C Max. 10sec. Max. 60sec.Max. Above 200C <2 : Lead-free Solder> 1~ 5C / sec. Pre-heating 180 ~ 200C 260C Max. 10sec. Max. 60sec.Max. Above 220C 2.5 ~ 5C / sec. 1~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 8.8 4 1 1 4 1.4 4 : Solder resist (Unit : mm) * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * Dip soldering should not be done more than one time. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. -5- Nichia STSE-CC5097A-1 -6- Nichia STSE-CC5097A ICI Chromaticity Diagram 0.9 520 530 0.8 510 0.7 550 540 560 0.6 570 500 0.5 580 590 0.4 600 y b1 0.3 490 c0 b2 610 620 630 a0 0.2 0.1 480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 x Color Coordinates Measurement allowance is 0.01. -7- Forward Voltage vs. Forward Current 100 Forward Current IFP (mA) Relative Luminosity (a.u.) 50 30 10 5 Ta=25C Forward Current vs. Relative Luminosity 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 Forward Current IFP (mA) Ta=25C Allowable Forward Current IFP (mA) Duty Ratio vs. Allowable Forward Current 100 50 30 10 5 Ta=25C 1 2.5 2.7 2.9 3.1 3.3 3.5 Forward Voltage VF (V) 1 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Forward Voltage 3.2 Relative Luminosity (a.u.) Forward Voltage VF (V) 3.1 3.0 2.9 2.8 2.7 2.6 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=5mA Ambient Temperature vs. Relative Luminosity 2.0 IFP=5mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 15.0 12.5 10.0 7.5 5.0 2.5 0 0 20 40 60 80 100 120 Ambient Temperature Ta (C) -8- 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STSE-CC5097A Model NHSW007 NICHIA CORPORATION Title No. CHARACTERISTICS 050610541581 Forward Current vs. Chromaticity Coordinate 1mA Ta=25C Spectrum Relative Emission Intensity (a.u.) 0.34 0.33 0.32 1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=5mA 5mA 10mA 30mA y 0.31 0.30 0.29 0.29 0.30 0.31 0.32 0.33 0.34 x Ambient Temperature vs. Chromaticity Coordinate IFP=5mA Directivity 1.0 Relative Luminosity (a.u.) 0.34 0 Ta=25C IFP=5mA 10 20 30 40 50 y -9- 0.33 0.32 0.31 0.30 -40C 0C 25C 50C 85C 0.5 60 70 80 0.29 0.29 0.30 0.31 0.32 0.33 0.34 x 0 90 60 30 Radiation Angle 0 0.5 90 1.0 Nichia STSE-CC5097A Model NHSW007 NICHIA CORPORATION Title No. CHARACTERISTICS 050610541591 1.2 (0.9) (R 0.3) Anode A (0.8) 1.05 (1.7) 2 Cathode mark (C 0.3) Cathode (0.4) (0.6) -10- K ITEM MATERIALS Heat-Resistant Polymer Epoxy Resin (with Diffused + Phosphor) Ag Plating Copper Alloy 1.3 PACKAGE (0.23) 1 (0.35) ENCAPSULATING RESIN ELECTRODES Nichia STSE-CC5097A Model NxSW007x Unit mm 15/1 Scale Allow 0.1 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 050610540822 1.750.1 Taping part 1.5+0.1 -0 40.1 20.05 0.250.05 Reel part 180+0 -3 11.41 90.3 3.50.05 Cathode mark 8+0.3 - 0.1 2.20.1 2 (2.75) 13 0.2 40.1 1-+0.2 0 1.360.1 1.440.1 Label XXXX LED TYPE NxSx007xT LOT xxxxxxQTY pcs Reel End of tape No LEDs LEDs mounting part No LEDs 60+1 -0 1 0.8 -11Embossed carrier tape Reel Lead Min.40mm (No LEDs) Reel Lead Min.160mm (No LEDs is more than 40) Pull direction Top cover tape Reel Lead Min.400mm Nichia STSE-CC5097A 3,000pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NxSx007xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 050530316604 Nichia STSE-CC5097A The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal NICHIA XXXX LED TYPE LOT QTY NxSx007xT xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NxSx007xT PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 3,000 MAX. Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 21,000 MAX. 45,000 MAX. 90,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NxSx007xT NICHIA CORPORATION Title No. PACKING 050530540761 -12- |
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